Microsoft 70-571 TS: Microsoft Windows Embedded CE 6.0. Developing

About Exam

• Customizing the Operating System Design (12%)
• Building and Deploying the Runtime Image (9%)
• Performing System Programming (22%)
• Debugging and Testing the System (17%)
• Customizing a Board Support Package (BSP)(17%)
• Developing Device Drivers (23%)

Exam Objectives

• Customizing the Operating System Design (12%)
• Configure the operating system (OS) design.
  May include but is not limited to: Create initial OS design for given board support package (BSP)/hardware; set the environment variables, build options, and regional settings; manage multiple configurations (for example, release/debug); identify appropriate catalog items; modify a build configuration to add a new catalog item to OS design
• Configure Windows Embedded CE projects.
• Clone a component.
• Generate a software development kit (SDK).
  May include but is not limited to: Create an SDK; configure an SDK; build an SDK
• Manage catalog items.
  May include but is not limited to: Integrate an existing driver into a Windows Embedded CE development environment; create a catalog item; verify and correct contents of a catalog file
  
• Building and Deploying the Runtime Image (9%)
• Build the runtime image.
  May include but is not limited to: Build from the IDE; build from the command line
• Analyze build results.
  May include but is not limited to: Interpret build failures; check build status; identify hidden failures (those not identified by IDE as build failures)
• Deploy the runtime image to target hardware.
  May include but is not limited to: Configure Platform Builder options; download operating system to the target hardware; connect to a target hardware
  
• Performing System Programming (22%)
• Monitor and optimize system performance.
• Implement system applications.
  May include but is not limited to: Implement control panel applet; launch a custom shell
• Implement threads and thread synchronization.
• Implement exception handling.
• Implement power management at the system level.
  May include but is not limited to: Application-level power management; power management scheme; Power Manager configuration
  
• Debugging and Testing the System (17%)
• Detect software-related errors.
  May include but is not limited to: Detect driver memory leaks; detect deadlocks; detect race conditions
• Configure the runtime image to enable debugging.
  May include but is not limited to: Entire image or individual module; enable profiling in the OEM Abstraction Layer (OAL)
• Test a system by using Windows Embedded CE 6.0 Test Kit (CETK).
  May include but is not limited to: Use existing CETK tests, including Stress test; create custom tests
• Test a boot loader.
• Customizing a Board Support Package (BSP)(17%)
• Configure a BSP.
  May include but is not limited to: Modify parameter files (bib, reg, dat files); modify build files
• Add power management support to an OEM Abstraction Layer (OAL).
• Configure memory mapping of a BSP.
• Implement a boot loader from existing libraries.
• Share driver resources between hardware and an OAL.
  May include but is not limited to: Shared memory; shared interrupts; shared I/O
  
• Developing Device Drivers (23%)
• Marshall data across boundaries.
  May include but is not limited to: Implement a data exchange mechanism between a driver and an application; implement communication between drivers and ha